BONDING APPARATUS

PURPOSE:To make it possible to perform bonding commonly for machines, by providing a mechanism, which computes a reference signal for recognizing positions, corrects the signal and recognizes the position based on the reference signal, and only preparing a dedicated program for every quality of each...

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Bibliographic Details
Main Authors SUEMATSU MUTSUMI, NEMOTO TOSHIYA
Format Patent
LanguageEnglish
Published 30.07.1986
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To make it possible to perform bonding commonly for machines, by providing a mechanism, which computes a reference signal for recognizing positions, corrects the signal and recognizes the position based on the reference signal, and only preparing a dedicated program for every quality of each work. CONSTITUTION:X-Y tables 9-11 sequentially move bonding too 6-8 to bonding positions based on programs. The original-point data of the X-Y tables and the driving in the direction of X axis for up and down movement are slightly different for each of wire bonders 2-4. Correcting values are computed for each of the wire bonders 2-4 beforehand. Correction is carried out so that the original-point data of the wire bonders 2-4 become equal by a correcting program 25. The program 25 is provided in a controller 31 for the wire bonders 2-4 and used as the original point data for a control circuit 32. The bonding program from a floppy disk 5 for a printed circuit board 1, which is a work inputted from the outside, is made to run. Then a system under control 33 can be accurately driven.
Bibliography:Application Number: JP19850008374