EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR

• Main Author: MATSUDA KIMIHIRO
• Format: Patent
• Language: English
• Published: 30.06.1986
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To perform uniform chemical treatment, by dividing a rotating stage surface in a plurality of concentric regions with a semiconductor wafer being held, and independently providing heating and cooling devices, which perform the temperature control of the divided regions, to separate preset temperature value. CONSTITUTION:The stage surface of a sucking stage 3 is divided into a plurality of concentric regions 2a and 2b. Heating and cooling elements 4 are attached to the regions 2a and 2b. A temperature sensor 5 is embedded in each heating and cooling element 4, and the temperature of each divided region is detected. The temperature of each divided region of a rotary sucking head is detected by the temperature sensor 5. Its output signal is inputted to a temperature adjustor 10 through a sliding contact point 7 for the temperature signal, a fixed contact point 9 for the temperature signal and an outer terminal 11. A control output with respect to said signal is sent to the heating and cooling element 4 through the outer terminal 11, a fixed contact point 8 for power supply and a sliding contact point 6 for power supply. Thus the temperature control of the heating and cooling element 4 is performed.