HIGHLY HEAT-RESISTANT THERMOPLASTIC POLYMER OF HIGH RIGIDITY

• Main Authors: HIRASAWA EISAKU, HAMAZAKI HIROHIDE
• Format: Patent
• Language: English
• Published: 20.06.1986
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PURPOSE:To obtain a thermoplastic polymer with high rigidity, heat resistance and heat fusibility, suitable for automobile ceiling panel, etc., by the reaction between ethylene-unsaturated carboxylic acid copolymer, etc., specific amine compound and specific amount of polyfunctional epoxy resin. CONSTITUTION:The objective polymer can be obtained by the reaction between (A) 100pts. by wt. of an ethylene-unsaturated carboxylic acid copolymer (e.g., ethylene-acrylic acid copolymer) or ion(zinc, cobalt, nickel, copper, lead or magnesium-derived)-crosslinked product, (B) pref. 2-15pts. by wt. of an amine compound having at least two primary ar secondary amino groups (e.g., hexamethylene-diamine) and (C) pref. 5-100pts. by wt. of a polyfunctional epoxy resin (pref., a solid one with an epoxy equivalent 400-5,000)(the amount being such as to represent the epoxy equivalent less than the amine equivalent of said amine compound).