DEPOSITING FILM FORMING MACHINE

• Main Authors: MORI EISAKU, MINOWA YOSHIFUMI, IWATANI YASUYUKI
• Format: Patent
• Language: English
• Published: 07.01.1986
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To preferably control the thickness of a film by providing means for detecting ionized filament for emitting electrons and cluster amount and means for controlling cluster amount on the basis of it when forming a depositing film by depositing cluster generated by injecting substance vapor in vacuum on a substrate. CONSTITUTION:When a cluster 6 passes an ionizing area 20, ionizing electrons are emitted from a filament 9a, the prescribed amount of electrodes are collected by an accelerating electrode 10, the electrons for ionizing the cluster 6 decreases its energy and are collected to a collecting electrode 12 without passing the area 20, and the electrodes not ionizing the area 20 but passing it are collected to a collecting electrode 13. Currents from the electrodes 10, 12, 13 are represented by I1, I2, I3, the sum is equal to the current from the filament 9a. Thus, the voltage to the filament 9a is so controlled that the current I2 contributing to the ionization of the cluster 6 increases to set the thickness of the film accumulated on the substrate 4 to a desired value.