LEAD FRAME

PURPOSE:To enable the measurement of stress in the periphery of a semiconductor element by a method wherein the central point of the section for die-bonding the element is positioned so as not to be on the point of symmetry with regard to a lead frame. CONSTITUTION:The central point of the section 1...

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Bibliographic Details
Main Authors KANESHIRO TOKUYUKI, YOKOYAMA TAKASHI
Format Patent
LanguageEnglish
Published 27.05.1985
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To enable the measurement of stress in the periphery of a semiconductor element by a method wherein the central point of the section for die-bonding the element is positioned so as not to be on the point of symmetry with regard to a lead frame. CONSTITUTION:The central point of the section 1 for die-bonding the semiconductor element to the lead frame is kept out of the center of the lead frame. After die-bonding of the element to such a frame, the element is sealed with resin in such a manner that the center of the frame superposes on the center of the sealing resin (center of the region drawn by a broken line 3). The more distant from the center of the resin, the larger amount of stress is applied to the element thus sealed; therefore the use of such a lead frame enables detailed investigation of the stress distribution of the element in the sealing resin.
Bibliography:Application Number: JP19830200814