PHOTOSENSOR DEVICE

PURPOSE:To improve adhesive performance of a substrate and an insulating film and effect distribution of a flawless resin film over an expansive area, by applying an Al2O3 over a glass substrate as the basic coat and forming a polyimide resin film as an insulating film for constructing a multi-layer...

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Bibliographic Details
Main Authors ORITSUKI RIYOUJI, KANAI HIROMI, SAITOU SUSUMU
Format Patent
LanguageEnglish
Published 25.04.1985
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Summary:PURPOSE:To improve adhesive performance of a substrate and an insulating film and effect distribution of a flawless resin film over an expansive area, by applying an Al2O3 over a glass substrate as the basic coat and forming a polyimide resin film as an insulating film for constructing a multi-layer interconnection structure. CONSTITUTION:An Al2O3 basic coat 2 1,500Angstrom thick is applied on a glass substrate 1, followed by 2,500Angstrom thick Cr coat is given. This coat of Cr forms the lower wiring 3. Further, a coat of polyimide resin is applied thereon for forming an insulating film 4 after drying at 230 deg.C and then, heat cured at 350 deg.C. Al is vapor deposited on the insulating film 4 with a thickness of 1mum to form the upper wiring 5. Thus, adhesive performance of a substrate 1 and a polyimide resin insulating film 4 becomes improved and distribution of a flawless polyimide resin film 4 over an expansive area becomes available.
Bibliography:Application Number: JP19830180279