INTEGRATED CIRCUIT PACKAGE

PURPOSE:To improve reliability of junctions by fixing a semiconductor element and lead pieces on an insulator substrate, interconnecting them with the use of metallic thin wires, covering the element with a cap and attaching heat dissipating fins to the rear side of the substrate with the use of a s...

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Bibliographic Details
Main Authors OOTSUKA KANJI, OGIWARA SATORU, KODAMA HIRONORI, USHIFUSA NOBUYUKI
Format Patent
LanguageEnglish
Published 17.04.1985
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To improve reliability of junctions by fixing a semiconductor element and lead pieces on an insulator substrate, interconnecting them with the use of metallic thin wires, covering the element with a cap and attaching heat dissipating fins to the rear side of the substrate with the use of a silicone rubber adhesive which forms a film of Young's modulus less than 500kg/cm . CONSTITUTION:A semiconductor element 1 is fixed on a substrate 4 of silicon carbide ceramic with the use of a metallic solder layer 7. A plurality of lead pieces 3 are also fixed thereon through a sealing glass layer 6. The element 1 and the lead pieces 3 are electrically connected through bonding wires 2, and the element 1 and the ends of the lead pieces 3 are covered with a cap 5. Then, cooling fins 9 are attached to the rear face of the substrate 4 with the use of an adhesive. Such an adhesive is a silicone, nytril rubber, phenolic or neoprene phenolic adhesive which forms a film 10 of Young's modulus less than 500kg/ cm so that occurrence of cracks in the heat cycle can be avoided.
Bibliography:Application Number: JP19830175958