LEAD FRAME

• Main Authors: TSUJIOKA MASANORI, OOTSUKA AKIRA, OGASA NOBUO
• Format: Patent
• Language: English
• Published: 08.03.1985
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To enable to manufacture a hybrid integrated circuit device, whereon a high-power consumption semiconductor element can be mounted, at a low cost by a method wherein a wiring substrate formed by a thick film forming method is provided on a metal substrate, which constitutes a metal frame as...