LEAD FRAME

PURPOSE:To enable to manufacture a hybrid integrated circuit device, whereon a high-power consumption semiconductor element can be mounted, at a low cost by a method wherein a wiring substrate formed by a thick film forming method is provided on a metal substrate, which constitutes a metal frame as...

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Bibliographic Details
Main Authors TSUJIOKA MASANORI, OOTSUKA AKIRA, OGASA NOBUO
Format Patent
LanguageEnglish
Published 08.03.1985
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To enable to manufacture a hybrid integrated circuit device, whereon a high-power consumption semiconductor element can be mounted, at a low cost by a method wherein a wiring substrate formed by a thick film forming method is provided on a metal substrate, which constitutes a metal frame as one component thereof. CONSTITUTION:Pads 11 for circuit formation and external leads 15 are formed by continuously performing a punching-out process or an etching process on a metal tape 10. The pad 11 for circuit formation of the lead frame obtained in such a way is coated with a ceramic made of Al2O3, SiO2, BN, etc., and circuits are formed thereon through an insulating glass. For example, a ceramic 14 is coated on the pad 11 for circuit formation, and an insulating glass 19 and conductive circuits 12 are performed a screen printing thereon and a semiconductor element 13 is mounted on a required part for obtaining a hybrid integrated circuit device.
Bibliography:Application Number: JP19830151879