LEAD FRAME
PURPOSE:To enable to manufacture a hybrid integrated circuit device, whereon a high-power consumption semiconductor element can be mounted, at a low cost by a method wherein a wiring substrate formed by a thick film forming method is provided on a metal substrate, which constitutes a metal frame as...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
08.03.1985
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Subjects | |
Online Access | Get full text |
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Abstract | PURPOSE:To enable to manufacture a hybrid integrated circuit device, whereon a high-power consumption semiconductor element can be mounted, at a low cost by a method wherein a wiring substrate formed by a thick film forming method is provided on a metal substrate, which constitutes a metal frame as one component thereof. CONSTITUTION:Pads 11 for circuit formation and external leads 15 are formed by continuously performing a punching-out process or an etching process on a metal tape 10. The pad 11 for circuit formation of the lead frame obtained in such a way is coated with a ceramic made of Al2O3, SiO2, BN, etc., and circuits are formed thereon through an insulating glass. For example, a ceramic 14 is coated on the pad 11 for circuit formation, and an insulating glass 19 and conductive circuits 12 are performed a screen printing thereon and a semiconductor element 13 is mounted on a required part for obtaining a hybrid integrated circuit device. |
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AbstractList | PURPOSE:To enable to manufacture a hybrid integrated circuit device, whereon a high-power consumption semiconductor element can be mounted, at a low cost by a method wherein a wiring substrate formed by a thick film forming method is provided on a metal substrate, which constitutes a metal frame as one component thereof. CONSTITUTION:Pads 11 for circuit formation and external leads 15 are formed by continuously performing a punching-out process or an etching process on a metal tape 10. The pad 11 for circuit formation of the lead frame obtained in such a way is coated with a ceramic made of Al2O3, SiO2, BN, etc., and circuits are formed thereon through an insulating glass. For example, a ceramic 14 is coated on the pad 11 for circuit formation, and an insulating glass 19 and conductive circuits 12 are performed a screen printing thereon and a semiconductor element 13 is mounted on a required part for obtaining a hybrid integrated circuit device. |
Author | OGASA NOBUO TSUJIOKA MASANORI OOTSUKA AKIRA |
Author_xml | – fullname: TSUJIOKA MASANORI – fullname: OOTSUKA AKIRA – fullname: OGASA NOBUO |
BookMark | eNrjYmDJy89L5WTg8nF1dFFwC3L0deVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAcFmBibGFqYGjsZEKAEAxr4dOg |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
ExternalDocumentID | JPS6043850A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_JPS6043850A3 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 15:35:29 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_JPS6043850A3 |
Notes | Application Number: JP19830151879 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19850308&DB=EPODOC&CC=JP&NR=S6043850A |
ParticipantIDs | epo_espacenet_JPS6043850A |
PublicationCentury | 1900 |
PublicationDate | 19850308 |
PublicationDateYYYYMMDD | 1985-03-08 |
PublicationDate_xml | – month: 03 year: 1985 text: 19850308 day: 08 |
PublicationDecade | 1980 |
PublicationYear | 1985 |
RelatedCompanies | SUMITOMO DENKI KOGYO KK |
RelatedCompanies_xml | – name: SUMITOMO DENKI KOGYO KK |
Score | 2.3617713 |
Snippet | PURPOSE:To enable to manufacture a hybrid integrated circuit device, whereon a high-power consumption semiconductor element can be mounted, at a low cost by a... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | LEAD FRAME |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19850308&DB=EPODOC&locale=&CC=JP&NR=S6043850A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQsUhLsbRINDLUTU20MNY1STIDDTSZp-pamKUA2UlGyYngE_h8_cw8Qk28IkwjmBgyYXthwOeEloMPRwTmqGRgfi8Bl9cFiEEsF_DaymL9pEygUL69W4iti1oKZLuYhSno-BU1Fydb1wB_F39nNWdnW68ANb8g22Az0JSXqYEjMwMrqBUNOmbfNcwJtCmlALlGcRNkYAsAGpZXIsTAlJonzMDpDLt4TZiBwxc63w1kQrNesQgDl4-ro4uCW5Cjr6sog4Kba4izhy7Q0Hi4B-K9AuDWG4sxsAD79akSDAppRkYWSckGycBef5JJiqFJIjC4LMwTLQzMU1KBud5SkkESpzFSeOSkGbhAIQFeKGUhw8BSUlSaKgusOUuS5MB-BgCmCnBn |
link.rule.ids | 230,309,786,891,25594,76906 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQsUhLsbRINDLUTU20MNY1STIDDTSZp-pamKUA2UlGyYngE_h8_cw8Qk28IkwjmBgyYXthwOeEloMPRwTmqGRgfi8Bl9cFiEEsF_DaymL9pEygUL69W4iti1oKZLuYhSno-BU1Fydb1wB_F39nNWdnW68ANb8g22Az0JSXqYEjMwOrOehwXlDLKcwJtCmlALlGcRNkYAsAGpZXIsTAlJonzMDpDLt4TZiBwxc63w1kQrNesQgDl4-ro4uCW5Cjr6sog4Kba4izhy7Q0Hi4B-K9AuDWG4sxsAD79akSDAppRkYWSckGycBef5JJiqFJIjC4LMwTLQzMU1KBud5SkkESpzFSeOTkGTg9Qnx94n08_bylGbhAoQJeNGUhw8BSUlSaKgusRUuS5MD-BwAOUXNU |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=LEAD+FRAME&rft.inventor=TSUJIOKA+MASANORI&rft.inventor=OOTSUKA+AKIRA&rft.inventor=OGASA+NOBUO&rft.date=1985-03-08&rft.externalDBID=A&rft.externalDocID=JPS6043850A |