RESIN-SEALED SEMICONDUCTOR DEVICE

• Main Authors: KATOU SATOO, TATENO KENICHI
• Format: Patent
• Language: English
• Published: 11.11.1985
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To enable to perform an adhered mounting the titled device on a circuit substrate with only connecting the external leads thereof to the circuit substrate using a solder and so forth and to assure heat dissipation through a molding resin by a method wherein the external leads are respectively led out from one side and the other side of the semiconductor element supporting substrate as a fine strip and a thick strip, interposing the supporting substrate between them. CONSTITUTION:A transistor element 17 is adhered on a semiconductor element supporting substrate 12 provided with a narrow strip 13 and a wide strip 14 havig a dimension W 0.4 times or more of the width L of the supporting substrate 12, both strips of which are respectively led out from one side and the other side of the supporting substrate 12 inerposing the supporting substrate 12 between them. The respective electrode of the base and the emitter of the transistor element 17 and external leads 15 and 16 are respectively connected using fine metal wires 18 and 19. After this, the supporting substrate 12 is position-regulated by the narrow strip 13 and the wide strip 14 in a form that the supporting substrate 12 is being made to float in the interior of a metal mold for molding and the part of a frame 20 indicated by broken lines is sealed with a resin for moldig. As a result, an adhesion of the semiconductor device and a circuit substrate and so forth is obtained with only connecting the external leads 13-16 to the circuit substrate and so forth using a solder and so forth.