PRINTED CIRCUIT BOARD

• Main Authors: MAEDA MASAHIKO, SAITOU YASUAKI, OOTANI TAKEJI, NAGATA KAZUYA
• Format: Patent
• Language: English
• Published: 01.10.1985
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS AS ADHESIVES; WORKING-UP

PURPOSE:To provide a printed circuit board having excellent heat resistance and dimensional stability, by laminating a metallic foil and a thermosetting resin on each other through a crosslinked article. CONSTITUTION:20-80wt% ethylene/(meth)acrylic acid copolymer having a (meth)acrylic acid content of 1-50wt% is melt-kneaded with 80-20wt% saponified ethylene/vinyl acetate copolymer having a vinyl acetate content of 1- 60wt% and a hydrolysis rate of 90% or above at 180 deg.C or below. The kneaded mixture is extruded into a thin-wall article at 250 deg.C or below water such conditions that no fish eye is formed. The extrudate is quenched. The resulting thin- wall article of 5-400mu in thickness is heated under pressure to obtain a crosslinked article 2. An electrically conductive metallic foil 1 of 15-400mu in thickness is laminated on a thermosetting resin-impregnated substrate 3 of 0.6-4.0mm. in thickness through the crosslinked article 2. The laminate is heated at 120- 250 deg.C under pressure to temporarily bond them, and then heated at 250 deg.C or above under pressure to bond them.