DEVICE FOR AUTOMATIC CONTROL OF PLATING CURRENT

PURPOSE:To improve electrode efficiency and to maintain a constant coating weight of plating by generating electrode efficiency by a function from a line speed and plating current density so that overall current reference can be compensated. CONSTITUTION:A titled device is provided with calculation...

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Bibliographic Details
Main Authors KAWAMOTO HARUO, GOSHI HIROO, NAGANO KATSUMI, HAMADA SHIGEJI, SHIIKI YASUO
Format Patent
LanguageEnglish
Published 09.07.1985
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:PURPOSE:To improve electrode efficiency and to maintain a constant coating weight of plating by generating electrode efficiency by a function from a line speed and plating current density so that overall current reference can be compensated. CONSTITUTION:A titled device is provided with calculation circuits 10, 12, a function generating circuit 13 which determines electrode efficiency by the prescribed function with the current density from said circuit and the line speed of a strip 1 as variables and a compensation circuit 14. The circuits 10, 12 calculate the current density of plating cells 3a-d from the total sum of the plating current. The circuit 14 compensates the 1st current reference by the above- described electrode efficiency and generates the 2nd current reference. The circuit controls the current according to the total sum of the plating current and the 1st current reference compensated so as to obtain the plating current density in a prescribed range in accordance with the line speed of the strip 1.
Bibliography:Application Number: JP19830237712