DEVICE FOR AUTOMATIC COMPENSATION AND CONTROL OF PLATING CURRENT

• Main Authors: KAWAMOTO HARUO, GOSHI HIROO, NAGANO KATSUMI, HAMADA SHIGEJI, SHIIKI YASUO
• Format: Patent
• Language: English
• Published: 09.07.1985
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

PURPOSE:To improve the gloss, electrode efficiency and corrosion resistance of a plated surface by compensating the excess or shortage of the coating weight of plating that arises with a change in the number of cells by the change rate of the number of cells so that current density can be controlled within a prescribed range. CONSTITUTION:A titled device is provided with a selection circuit 13 which selects the cells 3a-d to be conducted with electricity from the upperstream in the advancing direction of a strip 1 according to the line speed of the strip 1 passing through plural plating cells 3a-d and a control circuit which selects the excess or shortage of the coating weight of plating on the strip 1. The above-described control circuit controls the tracking of the strip 1 and the current density of the cells to be disconnected by changing the number of the cells at a prescribed change rate in the stage of changing the number of the cells to be conducted with electricity. Said circuit controls the current according to the result obtd. by comparing the total sum of the plating current supplied to the cells 3a-d and the current reference compensated so as to obtain the prescribed plating current in accordance with the line speed of the strip 1.