SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

PURPOSE:To decrease the noise generated on a power supply line by dividing a circuit formed to a semiconductor integrated circuit device into plural circuit blocks, and supplying power to each circuit block through the power supply line of multi-layer structure. CONSTITUTION:A wire L1 applying a pow...

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Bibliographic Details
Main Author SAWADA JIROU
Format Patent
LanguageEnglish
Published 27.06.1985
Edition4
Subjects
INFORMATION STORAGE
PHYSICS
STATIC STORES
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Summary:PURPOSE:To decrease the noise generated on a power supply line by dividing a circuit formed to a semiconductor integrated circuit device into plural circuit blocks, and supplying power to each circuit block through the power supply line of multi-layer structure. CONSTITUTION:A wire L1 applying a power voltage to an output buffer circuit OB and a wire L2 applying a ground potential thereto are constituted of the 1st aluminum layer, and they are connected to a bonding pad P1 to which a power is supplied from an external terminal VCC and a bonding pad P2 to which a ground potential is fed from an external terminal VSS. Moreover, a wire L3 applying power voltage to an input buffer circuit ADB or the like being the remaining circuit blocks and a wire L4 applying ground potential are constituted of the 2nd aluminum layer and they are connected respectively to the bonding pads P1 and P2.
Bibliography:Application Number: JP19830226824