FLUORINE-CONTAINING POLYAMIC ACID DERIVATIVE AND POLYIMIDE

PURPOSE:The titled polymer useful as a protecting film for semiconductors, multi-layer wiring film, etc. having improved water-vapor resistance and heat resistance, obtained from a tetracarboxylic acid derivative containing a fluorinated alkyl group and a diamine. CONSTITUTION:A polyamic acid deriva...

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Bibliographic Details
Main Authors FUJISAKI KOUJI, NUMATA SHIYUNICHI, KANESHIRO TOKUYUKI
Format Patent
LanguageEnglish
Published 08.06.1985
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Summary:PURPOSE:The titled polymer useful as a protecting film for semiconductors, multi-layer wiring film, etc. having improved water-vapor resistance and heat resistance, obtained from a tetracarboxylic acid derivative containing a fluorinated alkyl group and a diamine. CONSTITUTION:A polyamic acid derivative having a repeating unit shown by the formula I (Y1 and Y2 are -O-, group shown by the formula II, or formula III; Rf is perfluoroalkylene; X is alkyl, fluorinated alkyl, or halogen; R' is H, or alkyl; R is residue obtained after removal of two amino groups from diamine; m is 0- 3; n is 0-4). Or a polyimide having a repeating unit shown by the formula IV(Y1, Y2, Rf, X, R, m, and n are as shown in the formula I ). The polyamic acid has extremely improved solubility in solvents, a polar solvent such as DMSO, DMF, etc. may be used, and a widely used solvent such as THF, acetone, etc. may be used together, and in case of necessity only the widely used solvent may be used.
Bibliography:Application Number: JP19830211075