APPLICATION OF RESIST

• Main Author: KATOU YOSHIHIDE
• Format: Patent
• Language: English
• Published: 24.04.1984
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPARATUS SPECIALLY ADAPTED THEREFOR; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

PURPOSE:To enable to form easily the flat surface of a resist by a method wherein a substrate to be treated is held turning the surface to be treated to form the resist film toward the lower side, and a holding base is rotated blowing the resist liquid against the treating surface from the lower side. CONSTITUTION:The substrate 1 to be treated is attracted to the rotatingly holding base 3 turning the surface to be treated toward the lower side 8, and the resist liquid 2 is blown against the substrate 1 to be treated from the lower side jetting from nozzles 6, 6'. At the same time with completion of jetting, the rotatingly holding base 3 is rotated in a high speed to dry the resist. The resist 2 to be applied forms a flat surface on the treating surface according to gravity and centrifugal force, and is dried in this condition. The resist surface having thickness of the resist sufficient to bury step parts 5 and moreover having flatness is formed by application of the resist.