HEAT-RESISTANT FLAME-RETARDANT RESIN COMPOSITION

• Main Authors: WAJIMA MOTOYO, OGATA MASAJI, ISHII TAKEO
• Format: Patent
• Language: English
• Published: 21.03.1984
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PURPOSE:To provide titled composition of good storage stability, capable of readily converting to high-performance product on heating, comprising an epoxy resin, alkenyl phenol-based polymer, potential curing accelerator, and specific halogen compound. CONSTITUTION:The objective composition comprising (A) an epoxy resin (e.g., of bisphenol type), (B) an alkenylphenol-based polymer (with a polymerization degree of ca. 20-80, e.g., vinylphenol), (C) a potential curing accelerator (e.g., quaternary ammonium salt), and (D) a helogenated diphenyl compound of formula I or II [X1 and X10 are each H, Cl, or Br; among X1-X5 and X6-X10, at least three of them being Cl or Br, respectively; R is (hydroxy-substituted) alkylene] (e.g., 2,2',3,3',4,4',5,5'-oxtabromodiphenyl ether), and further, if required, (E) modifier, filler, reinforcer, etc.