ELECTRONIC CIRCUIT MODULE

• Main Author: MIO SHIGEMI
• Format: Patent
• Language: English
• Published: 08.03.1984
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

PURPOSE:To detect the risk of the breakdown of terminal connecting parts when the breaking possibility is present, by providing monitoring wirings in a multilayered substrate and in a semiconductor chip so that the parts between monitoring connecting parts are connected and one circuit is constitute...