ELECTRONIC CIRCUIT MODULE

• Main Author: MIO SHIGEMI
• Format: Patent
• Language: English
• Published: 08.03.1984
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

PURPOSE:To detect the risk of the breakdown of terminal connecting parts when the breaking possibility is present, by providing monitoring wirings in a multilayered substrate and in a semiconductor chip so that the parts between monitoring connecting parts are connected and one circuit is constituted. CONSTITUTION:Each monitoring part 3 is connected by an intrachip wiring 4 which is provided along each side of a semiconductor chip 1. Meanwhile, a multilayered ceramic substrate 5 has terminals at the positions corresponding to ordinary terminals 2 and the monitoring terminals 3. The parts between the monitoring terminals 3 and the part between the monitoring terminal 3 and a monitoring terminal 6 at the outside of the chip are connected by wirings 7 in the multilayered ceramic substrate 5. When a current is conducted through an electronic circuit module, the semiconductor chip 1 is heated and thermal expansion occurs. Conversely, when a power source is turned OFF, the temperature is decreased and the chip is contracted. Thus shearing stress is repeatedly applied to soldered connecting parts. When the power source is turned ON and OFF for more than certain number of times, thermal fatigue breakdown occurs. The first breakdown occurs at the monitoring terminals 3, which are located at the out side where the shearing stress is the largest. Therefore, opening of the monitoring terminal 6 of the electronic circuit module occurs before the ordinary terminals 2 are broken.