PAD ARRANGING METHOD FOR IC CHIP

PURPOSE:To readily mount an electronic device such as a thermal head or the like on an IC chip by continuously arranging driving and outputting pads along one side of the chip. CONSTITUTION:Driving and outputting pads O1-O32 are arranged in one row continuously along the up side of the surface of an...

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Bibliographic Details
Main Authors TAKAMATSU YASUHIKO, SUGANO OSAMU, OOTA MASATOSHI
Format Patent
LanguageEnglish
Published 14.02.1984
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To readily mount an electronic device such as a thermal head or the like on an IC chip by continuously arranging driving and outputting pads along one side of the chip. CONSTITUTION:Driving and outputting pads O1-O32 are arranged in one row continuously along the up side of the surface of an IC chip 6, three ground pads GND1-GND3 are arranged along the left side, and three ground pads GND4- GND6 are arranged along the right side. The emitters of 32 output transistors are all connected to a common ground line in the IC chip, three pads are led out along the left side of the chip 6 from the common ground line, and three pads are led out along the right side from the common ground line, and the yield of bonding to the ground pads can be largely improved by employing the common ground.
Bibliography:Application Number: JP19820136948