COOLING APPARATUS OF SEMICONDUCTOR ELEMENT

PURPOSE:To obtain the high cooling efficiency and at the same time reduce the size and weight of an apparatus by a method wherein, when a required electric circuit is composed by connecting a plurality of semiconductor elements in series, cooling fins are provided to an anode side and a cathode side...

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Bibliographic Details
Main Authors MINE SHINGO, YONEHATA YUZURU
Format Patent
LanguageEnglish
Published 15.11.1984
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To obtain the high cooling efficiency and at the same time reduce the size and weight of an apparatus by a method wherein, when a required electric circuit is composed by connecting a plurality of semiconductor elements in series, cooling fins are provided to an anode side and a cathode side of each element and the heavy duty elements are arranged inside and the light duty elements are arranged outside. CONSTITUTION:Semiconductor elements 1, 3, 4, 2 are connected in series in this order to compose a required electric circuit. In this composition, a cooling fin 13 is fixed to an anode side of the element 1 and a cooling fin 14 is connected to a cathode side of the element 1 and a cathode side of the element 3. A cooling fin 15 is fixed to an anode side of the element 3 and a cathode side of the element 4 and a cooling fin 16 is provided to an anode side of the element 4 and an anode side of the element 2 and at the same time a cooling fin 17 is provided to a cathode side of the element 2. These elements are connected in series through the fins 14-16. Thus the heavy duty elements 3 and 4 are positioned between the elements 1 and 2.
Bibliography:Application Number: JP19830076606