THERMAL TRANSFER MATERIAL

PURPOSE:To provide a thermal transfer material free from a sticking in use and easy to produce, wherein a water-soluble heat-resistant protective layer is provided on the lower side of a base provided with a heat-fusible ink layer on the upper side thereof. CONSTITUTION:The heat-fusible ink layer 3...

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Bibliographic Details
Main Authors TAMAOKI HIROYUKI, USAMI TOMOMASA
Format Patent
LanguageEnglish
Published 05.11.1984
Edition3
Subjects
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Summary:PURPOSE:To provide a thermal transfer material free from a sticking in use and easy to produce, wherein a water-soluble heat-resistant protective layer is provided on the lower side of a base provided with a heat-fusible ink layer on the upper side thereof. CONSTITUTION:The heat-fusible ink layer 3 is provided on the upper side of the base 4, and the water-soluble heat-resistant protective layer 8 consisting of ethyl cellulose, PVA, gelatin or the like is provided on the lower side of the base 4 to obtain the thermal transfer material 9. A conventional thermal transfer material comprising a heat-fusible ink layer has a defect in that favorable feed of the material is hindered by the sticking phenomenon in which a base brought into contact with a thermal head under pressure is fused. To improve the defect, a method has been disclosed in which a heat-resistant protective film consisting of a silicone resin, an epoxy resin or the like is provided on the lower side of the base. However, since the heat-resistant resin is insoluble in water, the method has a demerit in that the production process is complicated. The production of the thermal transfer material is facilitated by constituting the heat-resistant protective layer of a water-soluble material.
Bibliography:Application Number: JP19830069594