PACKAGE FOR INTEGRATED CIRCUIT

PURPOSE:To obtain the titled package which has a simple structure, capable of blocking the infiltration of water, etc. by emitting moisture or water infiltrating into the package, and can be satisfactorily applied for a small-sized device by a method wherein a heat generator which generates heat by...

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Bibliographic Details
Main Author SATOU IKUO
Format Patent
LanguageEnglish
Published 16.10.1984
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To obtain the titled package which has a simple structure, capable of blocking the infiltration of water, etc. by emitting moisture or water infiltrating into the package, and can be satisfactorily applied for a small-sized device by a method wherein a heat generator which generates heat by an external power source is provided around either one or both of the base end of the outer lead and a circuit element. CONSTITUTION:In addition to original signal giving and taking outer leads 12,..., power supplying outer leads 13, 13' are provided at the peripheral edge on the ceramic substrate 11 at fixed intervals, and the heat generator 14 such as a resistor is formed on said substrate 11 so as to surround the base end of these outer leads 12,...13, 13'. When a required voltage is supplied from the external power source 16 to the power supplying outer leads 13, 13', the heat generator 14 connected between said leads 13 and 13' generates heat. Therefore, even when moisture or water infiltrates through the interfaces of the outer leads 12,...13, 13' and epoxy resin 15, the moisture or water is exhaled by the heat generation of this heat generator 14, accordingly it does not infiltrate into the inside conduction path or the IC chip.
Bibliography:Application Number: JP19830056067