THERMOSETTING RESIN COMPOSITION AND ITS PREPOLYMER

• Main Authors: MORISHITA YASUSADA, WAJIMA MOTOYO, TAKAHASHI AKIO, SHIMAZAKI TAKESHI
• Format: Patent
• Language: English
• Published: 28.04.1983
• Subjects: ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS

PURPOSE:To obtain titled composition of excellent flexibility, capable of providing cured products with C-grade heat resistance, comprising a specific dicyanamide compound and an unsaturated bond-contg. polyvalent imide compound. CONSTITUTION:The objective composition can be obtained by blending preferably, (A) 7-3mol of a dicyanamide compound of formula (Y is a divalent organic group), e.g., 4,4'-dicyanamide diphenylmethane and (B) 3-7mol of an unsaturated bond-contg. polyvalent imide compound (e.g., N,N'-4,4'-diphenylmethane bis- maleimide), and furthermore, if required, (C) pref. 2-50wt%, based on the resultant composition, of one or more epoxy compounds, phenolic compounds, and triallyl isocyanurates, and a curing accelerator, curing catalyst, etc. Moreover, if necessary, said composition may be conserved in the form of a semi-cured prepolymer by heating to carry out preliminary reaction.