SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

• Main Authors: GONDOU HIROYUKI, OOKAWA YASUSHI, TAKAHARA KAZUHIRO, OKI KENICHI
• Format: Patent
• Language: English
• Published: 17.11.1983
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To obtain a large-sized and high quality indicating or image pickup mechanism for the titled device by a method wherein a connection electrode, to be connected to the driving circuit for picture element electrode, is provided on the side face of the substrate having a systematically arranged picture element. CONSTITUTION:All regions excluding the pad part 3a on the end face 1a of a substrate and the input-output electrode part 5 of the active element on a driving circuit 4, are covered by a resist mask and Al is vapor-deposited thereon. Said mask is removed and a pad 3a is formed. As the picture element alone is left on the upper part of the substrate 1 and there exists no connection electrode between chips, the distance between the picture element electrode group and the substrate end face can be made to one half or smaller of the pitch of the picture electrode, thereby enabling to obtain a large picture of prescribed size for graphic indication, by connecting the pad parts 3a each other. Beautiful picture is constructed in simple constitution because of the upper surface of the substrate of IC chip is all photo emitting region and the wiring between chips is needless.