MANUFACTURE OF SEMICONDUCTOR DEVICE
PURPOSE:To connect between a lower layer wiring and an upper layer wiring with a wiring material buried in a through hole, to enhance yield of a wiring system, and moreover to hold the upper part of the through hole flat by a method wherein the PR process is supplemented by one process per one wirin...
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Main Author | |
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Format | Patent |
Language | English |
Published |
28.10.1983
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Subjects | |
Online Access | Get full text |
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