MANUFACTURE OF SEMICONDUCTOR DEVICE

PURPOSE:To connect between a lower layer wiring and an upper layer wiring with a wiring material buried in a through hole, to enhance yield of a wiring system, and moreover to hold the upper part of the through hole flat by a method wherein the PR process is supplemented by one process per one wirin...

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Bibliographic Details
Main Author MIZUSHIMA KAZUYUKI
Format Patent
LanguageEnglish
Published 28.10.1983
Subjects
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