FLUORINE-CONTAINING POLYIMIDE, POLYAMIC ACID AND PRODUCTION THEREOF

• Main Authors: FUJISAKI KOUJI, NUMATA SHIYUNICHI, KANESHIRO TOKUYUKI
• Format: Patent
• Language: English
• Published: 22.10.1983
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PURPOSE:To obtain a fluorine-contg. polyimide or polyamic acid useful as various insulating films in electronics such as insulating film for the multi-layered wiring of semiconductor and having low hygroscopicity and excellent heat resistance, by reacting a specified diamine with a tetracarboxylic acid derivative. CONSTITUTION:A diamine of formula I (wherein R1 is -Cn F2n+1; n is 0-4) is reacted with a tetracarboxylic acid to obtain a polyimide having a repeating unit of formula I or a polyamic acid having a repeating unit of formula I (wherein R1 is Cn F2n+1; n is 0-4; R is H, lower alkyl). Usually, a polyimide film can be obtd. by coating its precursor polyamic acid, drying and curing it. When solvent resistance is required, the polymer is modified with a compd. of formula V (wherein R is a (2+m)-valent arom. org. group; X is -NH2, -CONH2, -SO2NH2 and situated at ortho position with respect to amino group; m is 1-2).