THERMOSETTING RESIN COMPOSITION AND PREPOLYMER THEREOF

• Main Authors: MORISHITA YASUSADA, WAJIMA MOTOYO, TAKAHASHI AKIO, KATAGIRI JIYUNICHI
• Format: Patent
• Language: English
• Published: 20.10.1983
• Subjects: ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS

PURPOSE:A thermosetting resin composition, containing a polyphenylmethylene polycyanamide compound expressed by a specific formula and a polyfunctional imide having unsaturated bonds, and capable of giving cured articles having the heat resistance in the C-stage. CONSTITUTION:A composition obtained by incorporating (A) a polyphenylmethylene polycyanamide of formula I (n is O or an integer >=1), e.g. a reaction product of a polyphenylmethylene polymine of formula II with cyanogen bromide, with (B) a polyfunctional imide having unsaturated bonds, e.g. N, N'- 4,4'-diphenylmethane bismaleimide, and preferably further (C) a polymerizable compound, e.g. an epoxy compound, phenolic compound or triallyl isocyanurate compound. The amounts of the componets are as follows: 7-3 mole component (A), 3-7 moles component (B) and 2-50wt%, based on the composition, component (C). The resultent composition is preliminarily reacted to give the B- stage and the aimed prepolymer. USE:Varishes for the impregnation, lamination, etc.