EXTRACTING METHOD FOR IMPURITY IN SLIVER PASTE FOR DIE BONDING

PURPOSE:To enable to simply and rapidly discriminate the propriety of silver paste and to select a silver paste material by extracting an impurity soluble in water contained in the paste. CONSTITUTION:This is a method of extracting an impurity by the steps of heating a sliver paste for uncuring die...

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Bibliographic Details
Main Authors NODA YASUMASA, IIRI SHIGEO, KATOU TOSHIHIRO
Format Patent
LanguageEnglish
Published 04.10.1983
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PURPOSE:To enable to simply and rapidly discriminate the propriety of silver paste and to select a silver paste material by extracting an impurity soluble in water contained in the paste. CONSTITUTION:This is a method of extracting an impurity by the steps of heating a sliver paste for uncuring die bonding to raise the past to its curing temperature, containing the cured powder in a sealed extractor together with water and heating it to 120-200 deg.C to extract the impurity. For example, uncured silver paste is heated at 200 deg.C for 10min., cured and then pulverized as a cured powder. 10g. of cured powder and 50g. of water are contained in the extractor, and heated at 200 deg.C for 2hr.
Bibliography:Application Number: JP19820050203