MANUFACTURE OF SEMICONDUCTOR DEVICE

• Main Author: MIKI KAZUYUKI
• Format: Patent
• Language: English
• Published: 29.09.1983
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To attain resin sealing generating no breaking and splitting by a method wherein cases of the upper and lower sides having respectively recessed parts on the mutually facing sides are formed using a composed matter with resin to be hardened according to light and heat, ultraviolet rays, etc., are irradiated to harden only the surface parts of the cases at first, and after parts to be sealed are accommodated in the recessed parts, the unhardened parts of the concave parts are hardened thermally. CONSTITUTION:The upper case 1 having the recessed part 100 on the junction face 10 side to fill the inside of the parts 3 to be sealed, and the lower case 2 having the recessed part 200 on the junction face 20 side are formed respectively using resin of epoxy resin, polyester resin, etc., to be hardened according to light and heat. Then the cases thereof are put on a conveyer 7 placing the junction faces 10, 20 on the lower side, light exposure (a) of ultraviolet rays, etc., is applied, and the surface layer parts only of the cases 1, 2 thereof are hardened at first by depth of 0.1-0.5mm.. After then, the parts 3 are positioned between the recessed parts 100, 200, and the heat treatment is performed to make the junction faces 10, 20 to be hardened. Accordingly, highly reliable resin sealing is attained at low cost.