MULTILAYER WIRING CONSTRUCTION

• Main Authors: ORITSUKI RIYOUJI, KANAI HIROMI, SAITOU SUSUMU
• Format: Patent
• Language: English
• Published: 16.09.1983
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To avoid any disconnection and to reduce resistance value by a method wherein, when matrix type multilayer thin film fine wiring pattern is formed on high molecular resin film to be interlayer insulating film, the wiring comprises at least two kinds of laminated metal body made of different materials with upper layer wiring slipped in the direction of line width to avoid throughholes. CONSTITUTION:The wiring layer 2 as the first layer comprising Cr of specified pattern is formed on glass substrate 1 and the entire surface including the layer 2 is coated with high molecular resin film 3 to be located on the specified positions on the wiring layer 2 drilling throughholes 4. Next another Cr wiring layer 5 as the second layer is formed on the film 3 perpendicular to said layer 2 connecting with one another in the holes 4. Then Al layer is evaporated on said layer 5 to reduce resistance and further etched by means of phosphoric acid, nitric acid, acetic acid and water to reduce its width down to around 1/2 of the line width of said layer 5 changing into another wiring layer 6 away from said holes 4. Through these procedures, any disconnection due to crack on the film 3 may be avoided reducing resistance value of said wiring layer 5.