CURING OF RESIN COMPOSITION

• Main Authors: MUKAI JIYUNJI, WAJIMA MOTOYO, OOHAYASHI HIROKO, KOYAMA TOORU
• Format: Patent
• Language: English
• Published: 30.08.1983
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PURPOSE:To improve a curing rate without detriment to storage stability, by adding a specified substituted urea to a resin composition comprising a polyepoxy compound, a polyisocyanate compound and a heterocyclic ring-forming catalyst. CONSTITUTION:A polyepoxy compound (e.g., diglycidyl ether of bisphenol A) is mixed with a polyisocyanate compound (e.g., methane diisocyanate) and a heterocyclic ring-forming catalyst (e.g., trimethylamine). The, the resulting resin composition is rapidly cured by adding thereto about 0.05-5wt% substituted urea of the formula (wherein R and R are each H, an alkyl, aryl, aralkyl or methylol) capable of enhancing the activity of the heterocyclic ring-forming catalyst, and heating the mixture. Examples of the substituted ureas of the formula include 1,3-dimethylurea, acetylurea, phenylurea, and methylolurea.