THERMOSETTING RESIN COMPOSITION

PURPOSE:To provide the titled resin compsn. for insulating, casting, or impregnating, excellent in crack resistance, adhesion, and dielectric properties, by combining a particular flexible polyol with a polyisocyanate having a moderate reactivity. CONSTITUTION:A polyol (A) comprising 70-97wt% liq. p...

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Bibliographic Details
Main Authors TERUNUMA NOBORU, TAJIMA TETSUO
Format Patent
LanguageEnglish
Published 15.07.1983
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PURPOSE:To provide the titled resin compsn. for insulating, casting, or impregnating, excellent in crack resistance, adhesion, and dielectric properties, by combining a particular flexible polyol with a polyisocyanate having a moderate reactivity. CONSTITUTION:A polyol (A) comprising 70-97wt% liq. polybutadiene homopolymer having hydroxyl groups at the both ends. MW 500-10,000 (or liq. styrene/butadiene copolymer, liq. acrylonitrile/butadiene copolymer) and 30- 3wt% short-chain diol (or short-chain triol), and a polyisocyanate (B) of the formula (wherein R is 2-5C alkylene) are mixed together in an equivalent ratio of (active hydrogen groups in polyol of component A) to (active hydrogen groups in polyisocyanate of component B) of 1:0.6-1.3 to yield a thermosetting resin compsn.
Bibliography:Application Number: JP19820000277