MANUFACTURE OF SHEET SHAPED THERMOCOUPLE

PURPOSE:To enhance durability against external pressurization and the like, by connecting the end parts of conducting wire parts wherein a copper layer and a Constantan layer are provided by through hole plating of copper. CONSTITUTION:The copper layer is provided on one surface of heat resistant re...

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Bibliographic Details
Main Authors NOUMI YUTAKA, MATSUDA ITSUO, KATOU MASAHISA
Format Patent
LanguageEnglish
Published 21.01.1983
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Summary:PURPOSE:To enhance durability against external pressurization and the like, by connecting the end parts of conducting wire parts wherein a copper layer and a Constantan layer are provided by through hole plating of copper. CONSTITUTION:The copper layer is provided on one surface of heat resistant resin film, e.g. polyimide resin film, the Constantan layer is provided on the other surface, and both layers are etched with the conducting wire part being left. Then through hole is perforated through the end parts of both conducting wire parts. Copper is plated on the inside of the hole and the conducting wire parts comprising copper and Constantan are connected. For example, an electrolytic copper foil 3 is stuck to one surface of Kapton film 1 through an epoxy series bonding agent layer 2, and a rolled Constantan foil 4 is stuck to the other surface through the same bonding agent layer 2. Then the conducting wire parts 5 and 6 in a specified shape are left, the etching is performed, and the through hole 7 is perforated through the conducting wire parts. The copper plated layer 8 is provided on the inside of the hole, and the copper and the constantan are connected.
Bibliography:Application Number: JP19810108877