EPOXY RESIN COMPOSITION AND ITS PREPARATION

• Main Authors: KAKEHI MITSUO, TAKI MASAHIRO, KANEKO KOUJI, KOSHIBE SHIGERU
• Format: Patent
• Language: English
• Published: 30.11.1982
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PURPOSE:To prepare an epoxy resin composition for preventing the occurrence of thin burr, having improved processing characteristics, by premixing raw materials for the epoxy resin composition with a proper amount of ultrafine silica powder having specific particle diameters, followed by kneading them. CONSTITUTION:An epoxy resin is blended with 0.2-2wt% silica powder having particle diametes of 5-30mmu (50-300Angstrom ), a releasant, pigment, etc., to give an epoxy resin composition. In blending, necessarily the silica powder is fully premixed partially or completely with one or more raw materials, and it is then mixed with the rest of the raw materials. In premixing, the epoxy resin and the resin raw materials such as a curing agent, etc. are preferably blended by a ball mill, fluidized bed, etc. as a device. EFFECT:The occurrence of thin burr having a thickness of <=30mmu (300Angstrom ) can be prevented.