DEVICE FOR DEELING BASE SHEET FROM BONDED ADHEREND

• Main Authors: YAMAMOTO KENJI, OOWADA MINORU, ITOU TAKAO, NIKAIDOU MASARU
• Format: Patent
• Language: English
• Published: 15.10.1982
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; CONVEYING; DYES; HANDLING THIN OR FILAMENTARY MATERIAL; LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PACKING; PAINTS; PERFORMING OPERATIONS; POLISHES; STORING; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

PURPOSE:To automatically peel and separate a base sheet from a bonded adherend with saved power, by giving a relative reciprocating motion in the axial direction of a serew of a tool part between the tool part having a screw thread and a material-supporting part. CONSTITUTION:Felt 1 supplied to a stepped portion 9 of a mount 8 is supported by a supporting part 7, and a tool part 4 is mounted on an actuator 5 and revolved in the direction of the arrow mark A, while being simultaneously raised by an actuator 6. The tool part 4 is pushed against base sheet 3 below the felt 1 through a hole 10, by revolving the tool part 4 right if the screw thread thereof is right- handed or left if left-handed. Thus the base sheet 3 is perforated and caught by the screw thread of the tool part 14 and moved toward the base of the tool part with revolution thereof. Thus peeling of the base sheet 3 from the felt 1 is started. The supporting part 7 rises and the base sheet 3 is completely separated from the felt 1, because the felt is supported by the supporting part 7 and the base sheet 3 is catched by the screw thread of the tool part 4.