PACKAGE FOR INTEGRATED CIRCUITS

PURPOSE:To accomplish cooling of elements efficiently by forming a cavity with the package comprising burying of elements with a resin and sealing with porous plates and wetting the porous plates with a cooling liquid.

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Bibliographic Details
Main Author MURATAKE KIYOSHI
Format Patent
LanguageEnglish
Published 23.06.1977
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To accomplish cooling of elements efficiently by forming a cavity with the package comprising burying of elements with a resin and sealing with porous plates and wetting the porous plates with a cooling liquid.
Bibliography:Application Number: JP19750150961