THERMOELECTRIC SYSTEM

PROBLEM TO BE SOLVED: To reduce the amount of heat transfer due to conduction, convection and radiation between the high-temperature side of a thermoelectric module and the low- temperature side of the same by a method wherein a closed circulation loop is formed by connecting a manifold, a hydraulic...

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Bibliographic Details
Main Authors SARGEANT GARY L, SEARLS JESSE H, ATTEY GRAEME S
Format Patent
LanguageEnglish
Published 16.03.1999
Edition6
Subjects
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Summary:PROBLEM TO BE SOLVED: To reduce the amount of heat transfer due to conduction, convection and radiation between the high-temperature side of a thermoelectric module and the low- temperature side of the same by a method wherein a closed circulation loop is formed by connecting a manifold, a hydraulic pump and a heat exchanger while fluid is circulated by the hydraulic pump from the manifold through the heat exchanger. SOLUTION: An electric current is impressed on a thermoelectric module 12 during the operation of a system 10. At the same time, a pump 44 is operated and liquid is returned from heat exchangers 46 into respective heat exchangers 46 through an inlet port conduit 40, a manifold 14 and an outlet conduit 42. The electric current is conducted to flow through the thermoelectric module 12 and, as a result, heat is sent out of the fluid, retained by heat exchangers 46, the conduits 40, 42 and the manifold 14 at one side, into the manifold 14, the conduits 40, 42 and the heat exchangers 46 at the opposite side whereby a refrigerating machine in the system is cooled while the system at the outside is heated. According to this method, heat can be transferred easily from the liquid, cooling respective side units of the thermoelectric module 12, to distant heat exchangers 46 whereby a temperature near that of atmosphere can be maintained.
Bibliography:Application Number: JP19980178175