PRODUCTION OF INSULATING VANISH, INSULATING VANISH OBTAINED THEREBY AND MULTILAYER PRINT CIRCUIT BOARD BY USING THE INSULATING VANISH
PROBLEM TO BE SOLVED: To obtain an insulating varnish excellent in dispersibility of at whisker; and appearance, and capable of manifesting high reliability, a low thermal expansion rate or the like by compounding a resin material with a solution comprising an electrically nonconductive whisker and...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
16.03.1999
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To obtain an insulating varnish excellent in dispersibility of at whisker; and appearance, and capable of manifesting high reliability, a low thermal expansion rate or the like by compounding a resin material with a solution comprising an electrically nonconductive whisker and a specific treating liquid. SOLUTION: (B) A resin material is compounded with a solution comprising (i) an electrically nonconductive whisker, preferably a ceramic whisker having 0.3-3.0 μm average diameter and 3-50 μm average length and (ii) a solvent treating liquid for treating the surface of the component (i) in the method for producing the objective insulating vanish. A solvent solution of a silane-based coupling agent, a solvent solution of a titanate-based coupling agent and a solution of a silicone oligomer having two or more siloxane repeating units and one or more functional groups reactive with hydroxy group on a substrate at the ends, or the like are preferably used as the component (ii). A resin used in a prepreg using a glass cloth as the substrate, a thermoset resin used in an adhesive film with a copper foil, or the like are preferably used as the component B. |
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Bibliography: | Application Number: JP19970275377 |