COOLER FOR ELECTRONIC EQUIPMENT OR ELECTRONIC PART

• Main Author: FUJIOKA ISAO
• Format: Patent
• Language: English
• Published: 09.03.1999
• Edition: 6
• Subjects: BLASTING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT EXCHANGE IN GENERAL; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL ENGINEERING; PRINTED CIRCUITS; WEAPONS

PROBLEM TO BE SOLVED: To provide a cooler which has such a cooling ability that is required to secure the high performance of electronic equipment or electronic parts and can be suitably used for the manufacture of plug-in unit type electronic equipment or elec tronic parts which can be repaired and exchanged easily. SOLUTION: Heat sinks 20, 64, and 65 are constituted by using heat pipes 23 and 30 which are divided into a unit-side system 23 and a chassis-side system 30. The heat pipes 23 and 30 transport heat which are absorbed by the heat sinks 20, 64, and 65 when the heat comes into contact with the sinks 20, 64, and 65 and radiate the heat to the outside through heat radiating fins 40 provided on the outside of a chassis. The thermal resistances of heat exchanging sections, for example, 24a and 66 are prevented from increasing by pressurizing the heat exchanging sections 24a and 66. At the time of manufacturing or servicing electronic equipment of electronic parts, the insertion and extraction of plug-in units 2a, 2b, and 2c are made easier by releasing the heat exchanging sections from the pressurized states. A collecting groove is provided to prevent oozing out of the heat transferring grease applied to the heat exchanging sections. The contacting areas of the heat exchanging sections are increased so as to reduce the thermal resistances of the sections by providing V-grooves and putting the grooves in each other.