BGA TYPE SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To avoid adverse effects due to effluence of an elastomer when an insulative film is fixed to a semiconductor chip, by forming the elastomer so that the frame sides have recesses. SOLUTION: The semiconductor device comprises a semiconductor chip 6 having bonding pads at the per...

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Bibliographic Details
Main Author NOKITA KANTA
Format Patent
LanguageEnglish
Published 09.03.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To avoid adverse effects due to effluence of an elastomer when an insulative film is fixed to a semiconductor chip, by forming the elastomer so that the frame sides have recesses. SOLUTION: The semiconductor device comprises a semiconductor chip 6 having bonding pads at the periphery with a wiring pattern and insulative film having solder balls which are connected to this pattern and extrude for external electric connections. The functional surface of the chip 6 is pasted through an elastomer 5 formed on the wiring pattern, leads 3s extending from the wiring pattern are connected to bonding pads, connections of the chip 6 to the leads 3s are covered with a coating material 7, and elastomer 5 is formed so that the right and left frame sides have recesses with taking account of the effluence of the elastomer in the width wise direction.
Bibliography:Application Number: JP19970244791