TRANSFER BELT FOR BELT TRANSFER TYPE CVD DEVICE

• Main Author: KUROKI MITSUSHI
• Format: Patent
• Language: English
• Published: 16.02.1999
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To minimize the amt. of reaction products deposited on the floor part of a reaction chamber and to prolong the frequency of the periodic maintenance of a CVD device by increasing the surface area of a transfer belt and largely adhering reaction products generated there to a transfer belt successively cleaned in the device. SOLUTION: As for a belt 10 for transfer wafers, the surface area is increased, e.g. by using a wire rod having fine wire size and netting the same into the shape of spirals or braids or subjecting the surface of the wire rod to bead blasting or sand blasting treatment or immersing the wire rod into a acidic or alkaline chemical to reduce the surface roughness. In this way, since its surface area is increased to increase the amt. of reaction products to be adhered compared to a transfer belt using a wire rod having a simply round or elliptic shape, on the other hand, the adhesion of reaction products to the floor part of the reaction chamber is reduced. As a result, the frequency of the periodic maintenance for executing the cleaning of the floor part of the reaction chamber can be prolonged.