MATERIAL FOR ELECTRIC AND ELECTRONIC PARTS, ITS PRODUCTION, AND ELECTRIC AND ELECTRONIC PARTS LISING THE SAME

• Main Authors: TANIMOTO MORIMASA, TANI TOSHIO, TANAKA HITOSHI
• Format: Patent
• Language: English
• Published: 21.12.1999
• Edition: 6
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a material suitable for electric and electronic parts, especially, lead material or contact material, which is excellent in resistance to heat and surface oxidation-discoloration and which exhibits little deterioration in the jointing strength at the jointing part when it is jointed with a solder, and to provide the method for producing the electric and electronic parts using the material. SOLUTION: This material is constituted of a substrate 1 wherein at least surface layer consists of Cu or Cu alloy, an intermediate layer 2 which is formed on the substrate and has at least one layer selected from Cu-layer, Ni-layer Ni alloy-layer or Ag-layer, and a surface layer 3 which is formed on the intermediate layer 2 and consists of a Sn- or Sn alloy-layer having Cu-content of 0.1-3 wt.% and a thickness of 0.5-20 μm.