RESIN GRINDING WHEEL FOR GRINDING SEMI-CONDUCTOR WAFER, AND ITS MANUFACTURE

• Main Authors: TOMITA KYOICHI, NUMATA SHUNICHI, ODA HIROTO
• Format: Patent
• Language: English
• Published: 21.12.1999
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GRINDING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a polished surface free from generation of scratches, and to improve the flatness performance by providing a grinding wheel in which a thermosetting resin of a specified quantity having the rubber elasticity and abrasive grains of a specified quantity having a specified maximum grain size are essential components, and specifying the modulus of compressive elasticity of a formed body. SOLUTION: A resin grinding wheel for polishing a semi-conductor wafer essentially consists of 5-20 wt.% thermosetting resin having the rubber elasticity, and 80-92 wt.% abrasive grains of <=2.0 μm in maximum grain size, and the modulus of compressive elasticity of a formed body is 1,000-8,000 kgf/cm . The thermosetting resin having this rubber elasticity is at least one kind selected from the silicone resin, polyurethane resin, unsaturated polyester resin or acrylic resin. The abrasive grains forming the composition of the grinding wheel are at least one kind selected from cerium oxide, silica or alumina. In a manufacturing method of the resin grinding wheel for grinding the semi-conductor wafer, the essential components are uniformly mixed, and the mixture is placed in a die, and hot-pressed at the press pressure of 200-1,200 kgf/cm , and the die temperature of 80-200 deg.C.