PRODUCTION OF SEMICONDUCTOR AND ELECTRONIC CONTROL CARD THEREFOR, SEMICONDUCTOR PRODUCTION SYSTEM AND SEMICONDUCTOR INSPECTION SYSTEM

PROBLEM TO BE SOLVED: To prevent a failed product from being taken in due to missing of process abnormality. SOLUTION: During wafer processing, a semiconductor production system 1 delivers system parameters concerning to the processing of a wafer to a data processor 2. The data processor 2 holds a p...

Full description

Saved in:
Bibliographic Details
Main Authors TSUNODA SHIGERU, GO NAOKI, SASAKI SHINJI, ANAMI HIDETOSHI
Format Patent
LanguageEnglish
Published 14.12.1999
Edition6
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:PROBLEM TO BE SOLVED: To prevent a failed product from being taken in due to missing of process abnormality. SOLUTION: During wafer processing, a semiconductor production system 1 delivers system parameters concerning to the processing of a wafer to a data processor 2. The data processor 2 holds a passed product acquisition probability distribution function obtained from past system parameters or inspection results of a semiconductor inspection unit 3, determines possibility of occurrence of abnormality in a wafer processed by the production system 1 by comparing received system parameters with the probability distribution function, and then determines an inspection method or priority of inspection of the inspection unit 3 for that wafer. When the abnormality occurrence probability is high, an alarm or a countermeasure is presented on the display of the production system 1 or a command for changing the number of inspection or recipe in the wafer plane or a lot depending on the kind of anticipated failure is delivered. When an inspection results are provided from the inspection unit 3, the probability distribution function is corrected based on inspection results and used for determining the abnormality occurrence probability of a wafer to be processed next.
Bibliography:Application Number: JP19980151421