HIGH STRENGTH AND HIGH CONDUCTIVITY COPPER ALLOY EXCELLENT IN HEAT TREATABILITY AT THE TIME OF PRESS PUNCHING

PROBLEM TO BE SOLVED: To obtain a copper alloy small in residual stress generated at the time of punching while maintaining characteristics required as those of a copper alloy for electrical and electronic parts, in which the residual stress generated by the punching is easy to remove by annealing i...

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Bibliographic Details
Main Author MIWA YOSUKE
Format Patent
LanguageEnglish
Published 14.12.1999
Edition6
Subjects
ALLOYS
CHEMISTRY
FERROUS OR NON-FERROUS ALLOYS
METALLURGY
TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Summary:PROBLEM TO BE SOLVED: To obtain a copper alloy small in residual stress generated at the time of punching while maintaining characteristics required as those of a copper alloy for electrical and electronic parts, in which the residual stress generated by the punching is easy to remove by annealing in the process of the punching, furthermore hard to be softened at the time of the annealing and good in heat resistance. SOLUTION: This alloy has a compsn. contg., by weight, 0.05 to 3.0% Fe, 0.01 to 0.4% P, 0.001 to 0.5% Ni, 0.005 to 2.0% Sn, 0.005 to 5.0% Zn, <0.01% Si, <=100 ppm O, <=10 ppm H, and the balance substantial Cu with inevitable impurities. Moreover, the alloy can contain one or >= two kinds among Mn, Zr, Cr, Al and In by 0.001 to 0.1% in total.
Bibliography:Application Number: JP19980150887