ADHESIVE COMPOSITION

PROBLEM TO BE SOLVED: To provide an adhesive excellent in an adhesive property in the field where its curing temperature is comparatively low, and not causing decoloring and the lowering of adhesive strength even for a long-term application. SOLUTION: This adhesive composition is prepared by blendin...

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Bibliographic Details
Main Authors OSANAI YOSHITAKA, BANDO IWAO, KAGEISHI KAZUJI
Format Patent
LanguageEnglish
Published 14.12.1999
Edition6
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:PROBLEM TO BE SOLVED: To provide an adhesive excellent in an adhesive property in the field where its curing temperature is comparatively low, and not causing decoloring and the lowering of adhesive strength even for a long-term application. SOLUTION: This adhesive composition is prepared by blending (A) 100 pts.wt. epoxy resin having its equivalent 100-2,000 with (B) 0.05-100 pts.wt. organoalkoxysilane having both glycidyl and hydrolyzable alkoxysilane in each molecule and (C) 0.01-10 pts.wt. aluminum chelate compound.
Bibliography:Application Number: JP19980151036