PRODUCTION OF RIGID POLYURETHANE FOAM HAVING REDUCED THERMAL CONDUCTIVITY AND ITS USE
PROBLEM TO BE SOLVED: To obtain the subject foam having a reduced thermal conductivity by reacting a (modified) organic polyisocyanate with a polyhydroxyl compound, an H-functional low-molecular-weight chain extender or crosslinking agent, a blowing agent, and a catalyst in the presence of additives...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
14.12.1999
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To obtain the subject foam having a reduced thermal conductivity by reacting a (modified) organic polyisocyanate with a polyhydroxyl compound, an H-functional low-molecular-weight chain extender or crosslinking agent, a blowing agent, and a catalyst in the presence of additives. SOLUTION: A rigid foam having a thermal conductivity of 0.018 W/mK or below is obtained by reacting (A) a (modified) organic polyisocyanate with (B) a polyhydroxyl compound having at least two reactive hydrogen atoms, a functionality of 2-8, and a molecular weight of 400-6,000 and represented by the formula, (e.g. a polyether polyol), 0-20 wt.%, based on component B, H-functional low-molecular-weight chain extender or crosslinking agent such as ethanolamine, a blowing agent such as cyclopentane, 0.001-5 wt.%, based on component B, catalyst such as tin laurate in the presence of additives such as a filler. In the formula, R is hydrogen, methyl, ethyl, or a 3-6C alkyl; R' is hydrogen, methyl, benzyl, or the like; (n) is 0-4; (m) is 1-3; (o) is 1-3; and X is an n-alkyl, an aralkyl, or the like. |
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Bibliography: | Application Number: JP19990112507 |