PHOTOCATIONICALLY POLYMERIZABLE EPOXY RESIN-BASED SOLID COMPOSITION AND ARTICLE

• Main Authors: NIIMOTO HARUKI, ASANO TOYOFUMI, KAWADA YOSHIHIRO, KOBAYASHI TAKUMI, UMEYAMA TOMOE, IMAIZUMI MASAHIRO
• Format: Patent
• Language: English
• Published: 26.11.1999
• Edition: 6
• Subjects: ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS

PROBLEM TO BE SOLVED: To provide a photoactionically polymerizable epoxy resin-based solid composition having excellent storage stability and giving smooth coating films. SOLUTION: This photocationically polymerizable epoxy resin-based solid composition comprises an epoxy resin of the formula [R1 is a 3-6C iso-alkyl group or a 4-6C tert-alkyl group; R2 is hydrogen atom, a halogen or a 1-6C alkyl group; (m) is an integer of 0-3] and a photocationic polymerization initiator. The solid composition preferably contains the epoxy resin of the formula [R1 is tert-butyl group; R2 is methyl group; (m) is 1] in an amount of 5-100% based the total amount of the epoxy resins.